Assessment Internship Opportunity at T&S LAW | Capital Market & Companies Act | Noida (On-Site)

T&S LAW is inviting applications for an Assessment Internship Program with a strong possibility of absorption into the firm based on performance.

This opportunity is ideal for serious law students and graduates who wish to build a career in Capital Markets, SEBI regulations, and corporate compliance under the Companies Act, 2013.


About T&S LAW

T&S LAW is looking for a diligent, detail-oriented individual with a strong understanding of the Companies Act, 2013 and a keen interest in capital market laws. The firm seeks candidates who are committed, disciplined, and willing to relocate for a full-time work-from-office internship in Noida.


Eligibility Criteria

  • 5th-year law students and law graduates
    (Note: Students in 4th year or below are not eligible under this internship policy.)
  • Strong legal research and drafting skills
  • Demonstrated interest in Capital Market and SEBI regulations
  • Self-motivated and capable of working independently
  • Ability to grasp complex legal concepts quickly and implement them practically

Key Responsibilities

  • Conducting CIBIL checks and Promoter Watchout reviews
  • Legal research and drafting assignments
  • Assisting in IPR Due Diligence and investment-related documentation
  • Handling appointment of directors and corporate compliances under the Companies Act, 2013
  • Supporting transaction-related documentation in capital market matters

Location

Noida (On-Site – Work from Office)

Candidates must be willing to commit to long working hours and demonstrate professional seriousness toward building a corporate law career.


Application Process

Interested and eligible candidates should send:

  • Updated CV
  • A short but well-structured cover email summarising suitability

To:
accounts@tandslaw.group
CC: info@tandslaw.in


Preference

Preference may be given to candidates who have previously interned with firms dealing in Capital Markets and SEBI Regulations.

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